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aktualisiert am 19. Mai 2024

ISBN 9783843938624

72,00 € inkl. MwSt, zzgl. Versand

978-3-8439-3862-4, Reihe Elektrotechnik

Lukas Mikutta
Thermal behavior and aging mechanisms of power device packages

204 Seiten, Dissertation Technische Universität Chemnitz (2018), Softcover, A5

Zusammenfassung / Abstract

With the conversion of the energy supply system towards renewable energy sources and the focus of the automotive industry on electric vehicles, knowledge of the reliability of power electronic components is crucial. Therefore in this thesis the thermal mechanical behavior of power electronic packages and related fatigue mechanisms are investigated. First different opportunities for increasing the short circuit ruggedness by measures of the packaging technology are evaluated. For that the metallization material and thickness are varied as well as the die attach technology. Subsequent the methodology of thermal mechanical simulations of packages under power cycling conditions is discussed and the stress-strain development on different points in the die attach layer is explained. Furthermore different factors impacting the result quality are pointed out.

The main focus of this thesis is on the thermal mechanical processes in power electronic packages. Hence different parameters like chip geometry, semiconductor material, die attach, package type and power cycling parameters are investigated to assess the respective impact on the mechanical load in the die attach layer.

In the end the failure location in insulated power modules depending on the power cycling conditions is evaluated with the help of simulations. Thereby the effect of different boundary conditions on the result accuracy is discussed.