Datenbestand vom 30. November 2020

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aktualisiert am 30. November 2020

ISBN 9783843940962

72,00 € inkl. MwSt, zzgl. Versand


978-3-8439-4096-2, Reihe Werkstoffwissenschaften

Martin Kommer
Mikrostruktur und mechanische Eigenschaften von Kupferbasis-Legierungen für Hochtemperaturanwendungen bis 900 K

152 Seiten, Dissertation Universität Erlangen-Nürnberg (2018), Hardcover, A5

Zusammenfassung / Abstract

As people become increasingly interested in electric vehicle concepts, there is a great demand for materials for the corresponding charging infrastructure, electric engines and automotive wiring. Taking into account the requirements for strength and electrical conductivity of the material this study outlines the correlation of microstructure and mechanical behavior of 16 copper alloys for applications up to 900 K. Based on pure and low alloyed copper the impact of phases and grain boundaries on mechanical properties and electrical conductivity was investigated. The aim was to identify the appeared strengthening mechanisms for each alloy. Measurement of the mechanical behavior vs. temperature was the preferred method to assess the relative influence of the four types of modification on total strength: Hall-Petch strengthening due to ultrafine grains, dispersion hardening, precipitation hardened microstructure and constitutional complex alloys (CCA).